Heat dissipation method for heat sink aluminum profile

One of the heat dissipation methods of electronic radiators: Heat conduction: Heat conduction refers to the transfer of heat from a high temperature area to a low temperature area through directly contacted objects. It is the  useful way to dissipate heat from junction to case and case to radiator of power semiconductor equipment.
The second method of heat dissipation of electronic radiators: thermal convection The density of the hot air around the heating object is lower than the density of the cold air nearby. 
The above is the relevant content of the description of the methods that can be used for the three electronic radiators. If you have any questions, you are welcome to inquire. We will continue to update more relevant instructions for you.